Technical Requirements rau kev sib tsoo hmoov hauv cov khoom siv polishing

Kev xav tau rau kev sib tsoo hmoov hauv cov ntaub ntawv polishing:
1, siab purity, tsis muaj impurities;
Thib ob, nws muaj qhov zoo dispersion los xyuas kom meej qhov sib xws thiab kev ua haujlwm ntawm cov txheej txheem ua haujlwm, thiab tuaj yeem ntxiv qhov tsim nyog tus nqi ntawm cov dispersant los txhim kho tus nqi ncua;
Thib peb, qhov sib tsoo hmoov particle loj yog sib xws, nyob rau hauv qhov tso cai particle loj ntau yam;
Plaub, cov khoom siv hlau polishing sib tsoo hmoov muaj txoj cai hardness thiab ntom, thiab cov dej muaj qhov zoo infiltration thiab raug tshem tawm, vim tias cov hmoov sib tsoo yuav tsum tau tov nrog dej;
Thib tsib, cov hmoov sib tsoo cov khoom muaj qee yam siv lead ua, tsim cov npoo ntse thaum tawg los txhim kho polishing efficiency;

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